Ericsson (NASDAQ: ERIC) and Intel have collaborated to utilize Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure.
According to reports Intel lost its lead in manufacturing the smallest and most power-efficient semiconductors to its rival TSMC and others.
As part of Ericsson and Intel, intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson which will result to differentiated leadership products for future 5G infrastructure.
The two companies will expand their collaboration to optimize 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN Boost for Ericsson’s Cloud RAN (radio access network) solutions which aims to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability, according to Ericsson’s report.
“Ericsson has a long history of close collaboration with Intel, and we are pleased to expand this further as we utilize Intel to manufacture our future custom 5G SoCs on their 18A process node, which is in line with Ericsson’s long-term strategy for a more resilient and sustainable supply chain,” said Fredrik Jejdling, Executive Vice President and Head of Networks, Ericsson. “In addition, we will be expanding our collaboration that we announced at MWC 2023 to work together with the ecosystem to accelerate industry-scale open RAN utilizing standard Intel Xeon-based platforms.”
“As our work together evolves, this is a significant milestone with Ericsson to partner broadly on their next-generation optimized 5G infrastructure. This agreement exemplifies our shared vision to innovate and transform network connectivity, and it reinforces the growing customer confidence in our process and manufacturing technology,” said Sachin Katti, Senior Vice President and General Manager of the Network and Edge group, Intel. “We look forward to working together with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future.”