Chip maker AMD, has detailed plans for its next phase of growth driven by multi-generational high-performance CPU and GPU roadmaps and aggressive technology investments designed to deliver leadership products and disruptive solutions.
“Our multi-generational computing and graphics roadmaps are designed to significantly accelerate revenue growth and deliver strong shareholder returns,” said Dr. Lisa Su, president and CEO, AMD. “We are focused on relentlessly executing our leadership IP roadmaps and aggressively introducing advanced technologies to drive sustained market share gains across the large and growing high-performance PC, gaming and data center markets.”
Su explained that having shipped more than 260 million “Zen” x86 cores in the AMD Ryzen and AMD EPYC processors, AMD is shared plans to build on this success with next-generation CPU core, packaging and interconnect innovations.
“AMD plans to introduce the first processors based on its next-generation ‘Zen 3’ core in late 2020,” she said. “The ‘Zen 4’ core is currently in design and is targeted to use advanced 5nm process technology.”
According to AMD, it plans to expand its chiplet and die stacking leadership, including new “X3D” packaging that combines chiplets and hybrid 2.5D and 3D die stacking to deliver more than a 10x increase in bandwidth density.
In addition, the chip designer announced that its upcoming third generation AMD Infinity Architecture have been optimised with CPU and GPU memory coherency that can enable significant performance improvements and simplify the software programming required for accelerated computing solutions by allowing the CPU and GPU to seamlessly and coherently share the same memory.
